Shadow Mask for Materials Deposition

e provide precision-engineered shadow masks for thin film deposition, patterning, and microfabrication applications. Designed for use in PVD, CVD, sputtering, and evaporation systems, our masks allow for accurate material deposition without the need for photolithography.

Key Specifications:
Thickness Range: 0.01mm to 5mm
Tolerance: ±0.002mm for exceptional accuracy
Feature Resolution: Minimum width of features as small as 0.02mm

  • Custom Designs – tailored shapes, sizes, and patterns to fit your project.
  • High Precision – micron-level accuracy for repeatable results.
  • Durable Materials – stainless steel, molybdenum, or nickel for long-term use in vacuum environments.
  • Applications – semiconductor R&D, sensor fabrication, display technology, and optics research.

To help you save money, we offer a simple Price Match Plus program. Just send us (support@design-realized.com) your quote from another supplier, and we’ll not only match it — we’ll also give you an additional 5% discount

shadow mask with 10um holes Request a Quote


Frequently Asked Questions (Shadow Mask)

1. What materials are available for custom shadow masks?

We offer a wide range of materials depending on your application:
• Stainless steel (SUS304, SUS316) – most common
• Nickel or Invar – high stability, low thermal expansion
• Molybdenum – high-temperature compatibility
• Silicon wafer masks – high-resolution micro-patterns
• Polyimide / Kapton films – flexible applications

For complex or ultra-fine features, stainless steel or Mo is recommended.

2. What thickness options are available?

Common thicknesses include:
• 0.02 mm – 0.10 mm (fine patterns, microfeatures)
• 0.10 mm – 0.20 mm (general-purpose evaporation/sputtering)
• 0.30 mm – 0.50 mm (large-area or high-strength masks)

The best thickness depends on your minimum feature size and aspect ratio.

3. What is the minimum feature size you can manufacture?

Typical minimum feature sizes:
• Laser cutting: down to 40–60 µm
• Micro-etching: down to 20–30 µm
• Silicon-based masks: <10 µm (special process)

Note: extremely small holes on thick metal (>0.5 mm) can cause poor evaporation fidelity due to shadowing.

4. Why are sharp corners not possible?

Sharp 90° corners cannot be fabricated because:
• Laser beams have circular spot shapes
• Etching processes naturally round corners

Final geometry typically has a ~10–20 µm radius, depending on thickness and method.

5. How accurate is the hole size and pattern alignment?

For stainless steel masks:
• Size tolerance: ±3–10 µm (depending on thickness)
• Position accuracy: ±5–20 µm

For silicon masks:
• Sub-micron alignment possible

Larger masks may experience slight bending; we recommend keeping the diameter ≤ 25 mm when possible.

6. Can I use the shadow mask for multiple depositions?

Yes. Stainless steel or Mo masks can be reused many times if properly cleaned.

Limitations:
• Thin masks (<0.05 mm) are more fragile
• Materials like Kapton are for one-time or limited use

High-temperature processes should use Molybdenum or thick stainless steel.

7. What file formats do you accept for custom mask designs?

Supported formats:
• DXF (preferred)
• DWG
• PDF
• STEP / IGES (converted by us)

If you only have a sketch, we can help convert it into production-ready CAD.

8. How do I determine the correct aspect ratio?

Ideal aspect ratio (thickness : smallest feature) is:
1 : 1 to 3 : 1

Example:
• 50 µm holes → recommended thickness = 30–100 µm

Very high ratios (e.g., 2 mm thick mask with 50 µm holes) will cause:
• Blocked metal flow • Poor contact during evaporation • Mis-shapen deposition

9. Do you provide alignment fixtures or holders?

Yes. We can supply:
• Magnetic alignment holders
• Spring-loaded frames
• Quartz or sapphire mask holders for high-temperature use
• Custom wafer alignment jigs

These help maintain uniform contact during PVD or thermal evaporation.

10. How do I request a quote?

Simply click the “Request Quote” button and include:
• Desired material & thickness
• Minimum hole size
• CAD drawings (DXF recommended)
• Application(evaporation / sputtering / lithography)

Our engineer will respond within 24 hours.