Thermal Evaporation system

Our thermal evaporation system is engineered for high-accuracy thin-film deposition in academic research labs and semiconductor fabrication facilities. With vacuum levels reaching 10⁻⁷ Torr and optional multi-source configurations, the system supports precise metallization, optical coating, surface modification, and electronic device prototyping.

Universities benefit from a user-friendly interface, safe operation controls, and modular chamber designs ideal for teaching labs and graduate research. Semiconductor fabs gain reproducible deposition rates, advanced QCM monitoring, clean vacuum environments, and optional automated control software for batch processing.

Whether depositing metals for microelectronics, reflective coatings for optics, or organic films for sensors, this system delivers stable, uniform, research-grade performance with full customization options.

Technical Spec Sheet Table 

Category Specification
Deposition Method Thermal (resistive) evaporation
Typical Materials Au, Ag, Al, Cu, Ni, Cr, Ti, organics, oxides
Vacuum Level 10⁻⁵ – 10⁻⁷ Torr (with turbo + backing pump)
Chamber Options Ø200–Ø450 mm stainless steel or glass bell jar
Source Options W boat, W coil, Mo boat, crucible hearth
Power Supply 0–300 A, 0–15 V or customized
Thickness Monitor Quartz crystal microbalance (QCM), ±1 Å precision
Substrate Size Up to 4", 6", or custom
Heating Optional substrate heater: RT–600°C
Rotation Optional substrate rotation for uniformity
Gas Integration Inert backfill (N₂/Ar)
Safety Overcurrent protection, vacuum interlocks, cooling options
Applications Thin films, metallization, optics, semiconductors, device R&D

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Frequently Asked Questions (FAQ)

1. What materials can be evaporated using the system?

The thermal evaporation system supports a wide range of materials including metals (Au, Ag, Al, Cu, Ni, Ti, etc.), organics, and certain oxides — as long as they can be safely evaporated under vacuum using the suitable source (boat, crucible, filament).

2. What vacuum levels does the system support?

The chamber can reach base vacuum levels down to ~10-5 – 10-7 Torr (depending on pump configuration). This enables clean, contamination-free thin film deposition suitable for research, optics, and semiconductor applications.

3. What wafer/substrate sizes and thicknesses are supported?

We support a variety of substrate sizes; standard options include small samples up to 4″ or 6″ wafers. Custom substrate holders and fixtures can be fabricated to accommodate non-standard sizes, shapes, or irregular samples. Film thickness can be controlled precisely via quartz crystal microbalance (QCM) monitoring.

4. Can you handle multi-source or multi-material evaporation jobs?

Yes — the system supports single or multiple evaporation sources (boat, crucible, filament). You may load different materials in separate sources for sequential deposition. Our engineers can also help design the loading plan and deposition schedule based on your material combination and desired stack structure.

5. Is substrate heating or rotation available?

Optional substrate heating and/or rotation fixtures are available. Heated substrate holders can reach elevated temperatures (depending on configuration), aiding better film adhesion or crystalline growth. Rotating substrate holders help achieve uniform thickness across larger substrates.

6. What post-deposition services do you offer?

Besides evaporation, we can offer optional services including annealing, thin-film lithography support, encapsulation, and preliminary testing of deposited films (e.g. thickness measurement, visual inspection). Please specify required services when requesting a quote.

7. How to request a custom evaporation job or get a quote?

Click the "Request a Quote" button on the page (or on any product page), fill out your project requirements — including material, substrate size, desired film stack, special conditions (vacuum level, heating, rotation) — and submit. Our engineer will review and respond within 24 hours.