Sputtering System
Sputtering (RF, DC)is a widely utilized physical vapor deposition (PVD) technique that is essential in various industrial applications, particularly in the fields of semiconductor manufacturing, microelectronics, and thin-film technology. This process involves the ejection of material from a target source, which is then deposited onto a substrate to form thin films with precise thickness and uniformity.
Schematic of sputtering system:
| Subsystem | Purpose |
|---|---|
| Vacuum pumps | Reach base pressure (10⁻⁶–10⁻⁸ Torr) |
| Mass flow controllers | Meter argon / reactive gases |
| Magnetron cathode | Holds target + magnetic confinement |
| Power supply | DC for metals / RF for insulators |
| Substrate stage | Heating, bias, rotation, cooling |
| Gauges | Pressure monitoring (Pirani + Ion gauge) |
| Interlocks | Safety (vacuum, power, gas, cooling) |
| Control PC | Automation + data logging |
Contact Us (support@design-realized.com) to Design Your Custom Sputtering System
We specialize in designing customized sputtering systems tailored to your specific applications. To help us prepare an accurate solution for you, please provide the following information:
- Target Materials: Which materials do you plan to deposit?
- Substrate Size: Do you have specific dimensional requirements? What substrate size will you use?
- Number of Targets: How many sputtering sources do you require?
