Semiconductor Device Fabrication service
We provide a complete, end-to-end device prototyping service that integrates materials synthesis, microfabrication, vacuum processing, thin-film deposition, precision machining, and system-level assembly. Our one-stop workflow helps researchers, engineers, and product developers rapidly transform concepts into fully functional prototypes.
With in-house capabilities including custom crystal growth, sputtering and thermal evaporation systems, MEMS processing, shadow-mask fabrication, CNC machining, 3D printing, and custom vacuum-chamber design, we eliminate multi-vendor delays and deliver fast, high-quality engineering results.
Whether you are developing semiconductor detectors, optical sensors, micro-devices, thin-film components, or full instrument assemblies, our engineering team supports the entire pipeline—from design review and CAD modeling to fabrication, packaging, and electrical/optical testing.
This service is ideal for universities, national labs, start-ups, and R&D programs that require rapid iteration, high precision, and customized materials and device solutions.
Technical Capability Sheet
| Category | Capabilities |
|---|---|
| Design & Modeling | CAD (SolidWorks/AutoCAD), optical & mechanical design, rapid simulation |
| Materials | Custom crystals, wafers, optical materials, scintillators, metals, ceramics |
| Thin-Film Processes | Sputtering, thermal evaporation, e-beam, masks, multi-layer stacks |
| Microfabrication | MEMS shadow masks, precision laser cutting (25–40 µm features), photomasks |
| Vacuum Hardware | Custom vacuum chambers, feedthroughs, fixtures, jigs |
| Machining | CNC milling, turning, EDM, polishing, sapphire/quartz rods & tubes |
| Additive Manufacturing | Plastic/Resin 3D printing, metal printing (selected parts) |
| Assembly & Packaging | Device integration, bonding, alignment, shielding, wiring |
| Testing | Electrical, optical, spectral, material characterization |
| Deliverables | Prototype device, drawings, BOM, test data, production recommendations |
Frequently Asked Questions (One-Stop Device Prototyping)
1. What types of devices can you prototype?
We support a wide range of research and industrial device prototyping, including:
• Semiconductor devices (detectors, sensors, photodiodes)
• Optoelectronic devices (LEDs, photodetectors, perovskite devices)
• MEMS & microfluidic chips
• Thin-film devices (X-ray detectors, solar cells, TFT structures)
• Packaging, module assembly, and test fixtures
Fully customized designs are welcome.
2. What services are included in your one-stop prototyping?
Our integrated prototyping workflow includes:
• Material sourcing (crystals, wafers, scintillators, optics)
• Mask design & photolithography
• Thin-film deposition (thermal evaporation, sputtering, ALD optional)
• Etching, patterning, micro-machining
• Packaging and wire-bonding
• Device assembly and reliability testing
Clients may choose full-process service or specific individual steps.
3. Do you support custom photomasks, shadow masks, and pattern designs?
Yes — we can fabricate:
• Photomasks (chrome, quartz, film)
• Laser-cut or etched shadow masks
• Micro-patterned metal or polymer stencils
Upload your GDSII/DXF file or send a sketch — our engineers can assist in converting it into fabrication-ready mask files.
4. What sample sizes or formats are supported?
We support:
• Small die (1 mm² – 20 mm²)
• 1″–6″ wafers
• Glass, sapphire, quartz, ceramic substrates
• Bulk crystals cut and polished to custom dimensions
We can also build custom holders or fixtures for irregular shapes.
5. Can you fabricate multi-layer or complex device stacks?
Yes. We offer:
• Multi-layer thin-film deposition
• Dielectric layers, metal electrodes, passivation
• Doped materials or gradient structures
• Insulating, conductive, and semiconducting layers
Thickness control can be monitored via QCM or optical methods.
6. Do you offer electrical or optical testing?
We can provide:
• I-V, C-V, photoconductivity, responsivity measurements
• X-ray / gamma response (for scintillator or detector devices)
• Spectral analysis and microscope imaging
Custom test scripts and automated measurements are available.
7. What information should I prepare before requesting a quote?
Please include:
• Device architecture or layer structure
• Materials and substrate type
• Mask files (DXF/GDSII) or sketches
• Expected device size or wafer size
• Packaging or testing requirements
The more details you provide, the more accurate the quote will be.
8. What is the typical lead time?
Lead time depends on complexity:
• Simple devices: 1–2 weeks
• Multi-layer or patterned devices: 2–6 weeks
• Complete prototypes with packaging/testing: 3–8 weeks
Rush services may be available depending on workload.
9. Can you manufacture small batches after prototyping?
Yes — we support:
• Single prototype
• Small batch production (5–100 pcs)
• Scaling up to pilot runs
Our process is designed for lab-scale and early-stage product development.
10. Do you sign NDAs for confidential projects?
Absolutely. We frequently work with universities, national labs, and companies on confidential devices.
An NDA can be signed before sharing designs or mask files.
11. How do I request a quote?
Click the “Request Quote” button and include your design files, sketches, materials, and processing steps.
Our engineers will respond within 24 hours.